Full Flip Chip COB Indoor Fine Pixel Pitch Display 800x337.5mm 21:9

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Product Feature

1. 21:9 Ultra-Wide Ratio
Designed with a unique 21:9 ultra-wide aspect ratio, this monitor is perfect for esports events and ultra-wide conference systems. It provides a panoramic viewing experience that elevates visuals with ultra-high definition, perfect for professional gaming settings and large corporate presentations. The ultra-wide format enables seamless content display, ensuring maximum visual engagement without distortion.

2. Large COB Modules for Enhanced Performance
Experience superior display quality with Hongwei's large COB modules, up to 200x337.5 mm in size. This module is a significant upgrade over standard industry products that typically feature 150x168.75 mm modules. The larger size allows for faster splicing, creates seamless connections between modules, and provides better display effects with enhanced uniformity and reduced bezels.

3. Full Flip Chip Common Cathode
Energy-efficient with low power consumption, high refresh rate, HDR for high dynamic picture display, and 16-bit high gray for low brightness.

More details

1. Full Flip Chip Common Cathode:

Adopting advanced full flip chip common cathode Micro LED technology, the screen temperature rise is extremely low, and under the same brightness conditions, it is more than 30% energy saving than traditional LED display. Supports full front maintenance and hot swap.

2. Dual Backup:

In the event of a failure of the main receiving card or power supply, the backup system will automatically switch over to ensure that the display is not interrupted, providing stronger stability and reliability for the large-screen display.

3. 21:9 Ultra-Wide Ratio:

With its unique 21:9 design, it is perfectly suitable for esports and ultra-wide screen conference system.

4. Less Splicing Lines:

Support full front maintenance, featuring hot-plug modules and cable-free connection. This design saves time and labor, thereby making users handle the LED screen with ease.